Electropolishing process in metal masks
Improving the release properties of cream solder! We support the resolution of quality issues and enhance quality.
Introducing "Electrolytic Polishing Process for Metal Masks." By applying electrolytic polishing treatment to SUS plates after opening processing, it is possible to smooth the unevenness of the inner walls of the openings. This treatment ensures stable and good solder printability for components such as QFPs and BGAs with a 0.4mm pitch, as well as 0603 chip components. Our technology supports the resolution of quality issues and enhances quality. [Features] - Improved release of cream solder - Ability to smooth the unevenness of the inner walls of the openings - Ensures stable and good solder printability *For more details, please refer to the PDF document or feel free to contact us.
- Company：東海神栄電子工業
- Price：Other
